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TECACOMP composite materials
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- Product description
- Specific applications
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TECACOMP TRMExcellent friction and mechanical properties.The TECACOMP TRM series products are optimized and enhanced for friction and mechanical performance, specifically developed for applications that require the best sliding performance, maximum strength, and minimal wear.TECACOMP TRM XS composites are designed for plastic parts that bear high mechanical loads. Special minerals are used instead of PTFE to ensure optimal sliding and friction performance.
TECACOMP LDSThis series of composites is used for laser direct molding.3D MID technologyMolded interconnect devices (MID) integrate conductors and circuits directly into three-dimensional plastic parts that can be molded freely, making the part both a housing and an electronic circuit. These molded circuit carriers enable companies to develop smaller, lighter, and cheaper components than those using traditional circuit boards. The installation of 3D MID systems is also simpler and can integrate more functions.No application has more extensive and diverse requirements for composites than MID technology. LDS requires composites to have good thermal resistance, isotropic performance of components, and most importantly, good metallization capability. Current material development trends focus on achieving reduced conductor widths and improvements in thermal expansion and thermal conductivity. Therefore, the selection of polymers is limited to plastics with high thermal stability.
TECACOMP HTEHigh thermal conductivity and electrically conductive composites.To meet the stringent requirements for extremely high electrical conductivity, the TECACOMP HTE material has been developed, which combines graphite and carbon black into a polymer matrix. The filler is mixed at a mass percentage of up to 90%.
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TECACOMP TRM series products are mainly used in: typical application fields with high friction and sliding loads include components in engines, high-performance gearboxes, vehicle transmission systems, and general pump products.
TECACOMP LDS This series of composite materials is used for laser direct forming 3D MID technology.TECACOMP HTEHigh thermal conductivity and electrical conductivity composite materials
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